The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Feb. 04, 2019
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Dan Carothers, Lucas, TX (US);

Ricky Jackson, Richardson, TX (US);

Rajarshi Mukhopadhyay, Allen, TX (US);

Ben Cook, Rockwall, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 23/522 (2006.01); H01L 21/762 (2006.01); H01L 49/02 (2006.01); H01L 29/417 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0649 (2013.01); H01L 21/762 (2013.01); H01L 21/76224 (2013.01); H01L 23/5223 (2013.01); H01L 23/5226 (2013.01); H01L 28/00 (2013.01); H01L 28/40 (2013.01); H01L 21/823481 (2013.01); H01L 29/4175 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48464 (2013.01);
Abstract

An integrated circuit is formed by forming an isolation trench through at least a portion of an interconnect region, at least 40 microns deep into a substrate of the integrated circuit, leaving at least 200 microns of substrate material under the isolation trench. Dielectric material is formed in the isolation trench at a substrate temperature no greater than 320° C. to form an isolation structure which separates an isolated region of the integrated circuit from at least a portion of the substrate. The isolated region contains an isolated component. The isolated region of the integrated circuit may be a region of the substrate, and/or a region of the interconnect region. The isolated region may be a first portion of the substrate which is laterally separated from a second portion of the substrate. The isolated region may be a portion of the interconnect region above the isolation structure.


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