The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Apr. 27, 2017
Applicant:
Cree, Inc., Durham, NC (US);
Inventors:
Michael John Bergmann, Raleigh, NC (US);
David Todd Emerson, Chapel Hill, NC (US);
Joseph G. Clark, Raleigh, NC (US);
Christopher P. Hussell, Cary, NC (US);
Assignee:
CREE, INC., Durham, NC (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 33/38 (2010.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/22 (2010.01); H01L 25/075 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0756 (2013.01); H01L 24/14 (2013.01); H01L 24/94 (2013.01); H01L 33/0095 (2013.01); H01L 33/38 (2013.01); H01L 33/486 (2013.01); H01L 33/507 (2013.01); H01L 33/62 (2013.01); H01L 24/81 (2013.01); H01L 33/0093 (2020.05); H01L 33/22 (2013.01); H01L 33/50 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13639 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/1411 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14155 (2013.01); H01L 2224/14177 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81805 (2013.01); H01L 2224/81895 (2013.01); H01L 2224/94 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01);
Abstract
An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.