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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10854584 B1

PDFFull Text
Date of Patent:
Dec. 01, 2020

Filed:

Apr. 27, 2017

Wafer level packaging of light emitting diodes (leds)

Applicant:

Cree, Inc., Durham, NC (US);

Inventors:

Michael John Bergmann, Raleigh, NC (US);

David Todd Emerson, Chapel Hill, NC (US);

Joseph G. Clark, Raleigh, NC (US);

Christopher P. Hussell, Cary, NC (US);

Assignee:

CREE, INC., Durham, NC (US);

Attorneys:

Withrow & Terranova, P.L.L.C.

Vincent K. Gustafson

Primary Examiner:

Matthew C Landau

Assistant Examiner:

Mark Hatzilambrou

Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 33/38 (2010.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/22 (2010.01); H01L 25/075 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0756 (2013.01); H01L 24/14 (2013.01); H01L 24/94 (2013.01); H01L 33/0095 (2013.01); H01L 33/38 (2013.01); H01L 33/486 (2013.01); H01L 33/507 (2013.01); H01L 33/62 (2013.01); H01L 24/81 (2013.01); H01L 33/0093 (2020.05); H01L 33/22 (2013.01); H01L 33/50 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13014 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13639 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/1411 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/14131 (2013.01); H01L 2224/14155 (2013.01); H01L 2224/14177 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81805 (2013.01); H01L 2224/81895 (2013.01); H01L 2224/94 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01);
Abstract

An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.

Find Patent Forward Citations

Bergmann, Michael. (2020). Wafer level packaging of light emitting diodes (leds) (U.S. Patent No. 10854584). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10854584

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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