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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10854559 B1

PDFFull Text
Date of Patent:
Dec. 01, 2020

Filed:

Jun. 29, 2019

Methods and modules related to shielded lead frame packages

Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventor:

Howard E. Chen, Anaheim, CA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:

Chang & Hale LLP

Primary Examiner:

Jami Valentine Miller

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/3205 (2006.01); H01L 21/48 (2006.01); H01L 23/66 (2006.01); H01Q 1/48 (2006.01); H01Q 1/24 (2006.01); H04B 15/00 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/32051 (2013.01); H01L 21/4825 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49531 (2013.01); H01L 23/49541 (2013.01); H01L 23/66 (2013.01); H01Q 1/243 (2013.01); H01Q 1/48 (2013.01); H04B 15/00 (2013.01); H01L 21/568 (2013.01); H01L 23/49548 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/45099 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18165 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01);
Abstract

Devices and methods are disclosed, related to shielding and packaging of radio-frequency (RF) devices on substrates. In some embodiments, a method for providing electro-magnetic interference shielding for a radio-frequency module can include applying a metal-based covering over a portion of a lead-frame package, the package having a plurality of pins with at least one pin exposed from overmold compound and in contact with the metal-based covering. The method can also include mounting the lead-frame package on a substrate. The method can further include connecting the metal-based covering to a ground plane of the substrate.

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