The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Sep. 19, 2018
Applicant:

Shenzhen Goodix Technology Co., Ltd., Shenzhen, CN;

Inventors:

Shengbin Zhang, Shenzhen, CN;

Kai Liu, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 29/06 (2006.01); H01L 23/29 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3121 (2013.01); H01L 23/13 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 29/0657 (2013.01); H01L 21/56 (2013.01); H01L 23/293 (2013.01); H01L 23/3128 (2013.01); H01L 24/45 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32155 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/4824 (2013.01); H01L 2224/4826 (2013.01); H01L 2224/48101 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/73277 (2013.01); H01L 2224/9222 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/1576 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/3511 (2013.01);
Abstract

Embodiments of the present application provide the chip packaging structure, the chip module and the electronic terminal. In the chip packaging structure, the chip is accommodated in the trench of the substrate to decrease the thickness and volume of the chip packaging structure; and the plastic package is provided on the surface of the substrate on which the chip is disposed to plastically package the chip, which not only ensures the structural strength of the chip packaging structure, but also reduces the warpage that may be caused due to the decrease of the thickness of the chip packaging structure as much as possible. In addition, the surface of the plastic package is treated to be a flat surface, such that the chip module has good flatness and the adaptability of the chip module is improved.


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