The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Aug. 05, 2019
Applicant:

Abb Schweiz Ag, Baden, CH;

Inventors:

David Guillon, Vorderthal, CH;

Charalampos Papadopoulos, Lenzburg, CH;

Dominik Truessel, Bremgarten, CH;

Fabian Fischer, Baden, CH;

Samuel Hartmann, Staufen, CH;

Assignee:

ABB Schweiz AG, Baden, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 23/24 (2006.01); H01L 23/31 (2006.01); H01L 23/492 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 23/24 (2013.01); H01L 23/3135 (2013.01); H01L 23/492 (2013.01); H01L 24/48 (2013.01); H01L 24/72 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01);
Abstract

The present application provides a power semiconductor module, including a support which carries at least one power semiconductor device, the support together with the power semiconductor device is at least partly located in a housing, the support and the power semiconductor device are at least partly covered by a sealing material, additionally to the sealing material, a protecting material is provided in the housing, the protecting material is formed from silicon gel and the protecting material at least partly covers at least one of the support, the power semiconductor device and the sealing material.


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