The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Aug. 26, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Min Gyu Sung, Latham, NY (US);

Kwanyong Lim, Niskayuna, NY (US);

Hiroaki Niimi, Cohoes, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/532 (2006.01); H01L 21/285 (2006.01); H01L 29/417 (2006.01); H01L 23/485 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76846 (2013.01); H01L 21/28518 (2013.01); H01L 21/76855 (2013.01); H01L 21/76856 (2013.01); H01L 23/485 (2013.01); H01L 29/41766 (2013.01); H01L 23/53266 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Aspects of the present invention relate to approaches for forming a narrow source-drain contact in a semiconductor device. A contact trench can be etched to a source-drain region of the semiconductor device. A titanium liner can be deposited in this contact trench such that it covers substantially an entirety of the bottom and walls of the contact trench. An x-metal layer can be deposited over the titanium liner on the bottom of the contact trench. A titanium nitride liner can then be formed on the walls of the contact trench. The x-metal layer prevents the nitriding of the titanium liner on the bottom of the contact trench during the formation of the nitride liner.


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