The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Jul. 02, 2018
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Jean Charbonnier, Grenoble, FR;

Frederic-Xavier Gaillard, Voiron, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 21/70 (2006.01); C23C 16/24 (2006.01); H01L 21/56 (2006.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/2007 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/7806 (2013.01); C23C 16/24 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/94 (2013.01);
Abstract

Method for producing an interface for assembling temporarily a microelectronic support and a handle, comprising at least the formation of a first layer comprising at least one material capable of releasing at least one chemical species under the action of a physical-chemical treatment, the formation of a second layer comprising at least one material capable of receiving the at least one chemical species so as to cause its embrittlement, and the embrittlement of the interface by application of a heat treatment, such that the at least one species is released from the first layer and reacts with all or part of the material of the second layer.


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