The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Jun. 01, 2017
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventors:

Pierre Montmeat, Froges, FR;

Frank Fournel, Villard-Bonnot, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A method for manufacturing a handling device includes depositing a single layer of an adhesive on a first surface of a first wafer; depositing an antiadhesive layer on a first surface of a second wafer different from the first wafer; bringing into contact the first wafer and the second wafer, the bringing into contact taking place at the level of the single adhesive layer of the first wafer and the antiadhesive layer of the second wafer; separating the first wafer and the second wafer; the first wafer including the single adhesive layer forming a handling device. The bringing into contact of the first wafer and the second wafer is carried out at a temperature Tsuch that T>T+100° C. where Tis the glass transition temperature of the material composing the single adhesive layer of the first wafer.


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