The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Oct. 27, 2016
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Yuji Tanaka, Kyoto, JP;

Masaya Asai, Kyoto, JP;

Masahiko Harumoto, Kyoto, JP;

Koji Kaneyama, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); G03F 7/16 (2006.01); B05B 1/28 (2006.01); B05C 11/02 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01); G03F 7/09 (2006.01); G03F 7/004 (2006.01); G03F 7/30 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67051 (2013.01); B05B 1/28 (2013.01); B05C 11/02 (2013.01); G03F 7/0043 (2013.01); G03F 7/091 (2013.01); G03F 7/094 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/3021 (2013.01); H01L 21/6715 (2013.01); H01L 21/67017 (2013.01); H01L 21/6719 (2013.01); H01L 21/67173 (2013.01); H01L 21/67178 (2013.01); H01L 21/67742 (2013.01); H01L 21/68735 (2013.01); H01L 21/68785 (2013.01); H01L 21/68792 (2013.01);
Abstract

A substrate is held and rotated by a spin chuck, and a coating liquid is discharged to the substrate. The coating liquid that is splashed outwardly from the substrate is received by an outer cup. A cleaning liquid that has been discharged from a cup cleaning nozzle is discharged to an inner peripheral surface of the outer cup through a first guide to clean the outer cup. Thus, the coating liquid, its solidified matter and the like adhering to the outer cup are dissolved and removed from the outer cup. Subsequently, a metal removal liquid that has been discharged from the cup cleaning nozzle is discharged to an inner peripheral surface of the outer cup through a second guide. Thus, a metallic component remaining on the outer cup is dissolved and removed from the outer cup.


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