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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10854388 B1

PDFFull Text
Date of Patent:
Dec. 01, 2020

Filed:

Jun. 15, 2018

Ceramic electronic component, method of producing the same, and electronic component mounting substrate

Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Masaki Mochigi, Tokyo, JP;

Kazuya Sato, Tokyo, JP;

Yousuke Nakada, Tokyo, JP;

Assignee:

TAIYO YUDEN CO., LTD., Tokyo, JP;

Attorney:

Saliwanchik, Lloyd & Eisenschenk

Primary Examiner:

Timothy J Thompson

Assistant Examiner:

Guillermo J Egoavil

Int. Cl.
CPC ...
H01G 4/008 (2006.01); H01G 4/12 (2006.01); H01G 4/228 (2006.01); H01G 4/30 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01G 4/232 (2006.01); H01G 2/06 (2006.01); H01G 4/012 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01G 4/228 (2013.01); H01G 2/06 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H05K 1/11 (2013.01); H01G 4/008 (2013.01); H01G 4/012 (2013.01); H01G 4/1227 (2013.01); H05K 1/181 (2013.01); H05K 3/3426 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10946 (2013.01); H05K 2201/2045 (2013.01);
Abstract

A ceramic electronic component includes a ceramic body, a sintered metal film, and a metal terminal. The ceramic body includes internal electrodes. The sintered metal film has a joint surface having a surface roughness Ra of 0.200 μm or less. The sintered metal film is connected to the internal electrodes and formed on a surface of the ceramic body. The metal terminal is jointed to the joint surface.

Find Patent Forward Citations

Mochigi, Masaki. (2020). Ceramic electronic component, method of producing the same, and electronic component mounting substrate (U.S. Patent No. 10854388). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10854388

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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