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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10854357 B1

PDFFull Text
Date of Patent:
Dec. 01, 2020

Filed:

Jul. 06, 2017

Coating material for forming conductive release layer, method for producing same, conductive release film, and method for producing same

Applicant:

Shin-etsu Polymer Co., Ltd., Tokyo, JP;

Inventors:

Sou Matsubayashi, Saitama, JP;

Kohei Kanto, Saitama, JP;

Assignee:

SHIN-ETSU POLYMER CO., LTD., Tokyo, JP;

Attorney:

Lando & Anastasi, LLP

Primary Examiner:

Vivian Chen

Int. Cl.
CPC ...
H01B 13/00 (2006.01); H01B 1/12 (2006.01); H01B 5/14 (2006.01); H01B 3/42 (2006.01); C09D 5/24 (2006.01); C09D 7/65 (2018.01); C09D 7/40 (2018.01); C09J 7/40 (2018.01); C09D 167/03 (2006.01); C09D 125/08 (2006.01); C09D 167/02 (2006.01); C09D 181/00 (2006.01); C09D 7/20 (2018.01); C09D 125/18 (2006.01); C09D 183/04 (2006.01); C09D 141/00 (2006.01); C09J 167/02 (2006.01); C09J 181/00 (2006.01); C09J 125/18 (2006.01); C09J 125/08 (2006.01); C09J 7/20 (2018.01); C09J 183/04 (2006.01); C09J 167/03 (2006.01); C09J 167/00 (2006.01); C08K 5/3492 (2006.01); C08K 5/3477 (2006.01); C08K 5/1515 (2006.01); C08K 3/08 (2006.01); C08K 5/3467 (2006.01); B05D 3/02 (2006.01); B05D 5/08 (2006.01); B05D 5/12 (2006.01);
U.S. Cl.
CPC ...
H01B 13/0036 (2013.01); C09D 5/24 (2013.01); C09D 7/40 (2018.01); C09D 7/65 (2018.01); C09J 7/401 (2018.01); H01B 1/122 (2013.01); H01B 1/127 (2013.01); H01B 3/421 (2013.01); H01B 5/14 (2013.01); B05D 3/02 (2013.01); B05D 5/08 (2013.01); B05D 5/12 (2013.01); C08K 3/08 (2013.01); C08K 5/1515 (2013.01); C08K 5/3467 (2013.01); C08K 5/3477 (2013.01); C08K 5/34924 (2013.01); C09D 7/20 (2018.01); C09D 125/08 (2013.01); C09D 125/18 (2013.01); C09D 141/00 (2013.01); C09D 167/02 (2013.01); C09D 167/03 (2013.01); C09D 181/00 (2013.01); C09D 183/04 (2013.01); C09J 7/20 (2018.01); C09J 7/201 (2018.01); C09J 7/405 (2018.01); C09J 125/08 (2013.01); C09J 125/18 (2013.01); C09J 167/00 (2013.01); C09J 167/02 (2013.01); C09J 167/03 (2013.01); C09J 181/00 (2013.01); C09J 183/04 (2013.01); C09J 2301/314 (2020.08); C09J 2425/005 (2013.01); C09J 2467/005 (2013.01); C09J 2467/006 (2013.01); C09J 2471/005 (2013.01); C09J 2481/005 (2013.01); C09J 2483/005 (2013.01); H01B 1/12 (2013.01); H01B 1/124 (2013.01); Y10T 428/1476 (2015.01); Y10T 428/31786 (2015.04);
Abstract

Provided is a coating material for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating material for forming a conductive release layer of the present invention contains a conductive composite including a π-conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.

Find Patent Forward Citations

Matsubayashi, Sou. (2020). Coating material for forming conductive release layer, method for producing same, conductive release film, and method for producing same (U.S. Patent No. 10854357). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10854357

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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