The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Jun. 07, 2019
Avatar Integrated Systems, Inc., Santa Clara, CA (US);
Ping-San Tzeng, Fremont, CA (US);
Mingsheng Han, Fremont, CA (US);
Yucheng Wang, Cupertino, CA (US);
Avatar Integrated Systems, Inc., Santa Clara, CA (US);
Abstract
Improving an initial via in a circuit comprises: obtaining layout information associated with an initial via structure in a circuit, the initial via comprising an initial lower metal enclosure and an initial upper metal enclosure connected by an initial cut; determining layout information associated with a multiconnection via structure comprising a plurality of sibling vias having at least one additional upper metal enclosure and at least one additional lower metal enclosure; updating the layout information associated with the initial via with the layout information associated with the multiconnection via structure; and outputting the updated layout information. The plurality of sibling vias are connected by a plurality of corresponding sibling cuts, and the multiconnection via structure has lower resistance than the initial via structure. In some embodiments, the multiconnection via is efficiently represented in using a master template.