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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10852318 B1

PDFFull Text
Date of Patent:
Dec. 01, 2020

Filed:

Jan. 09, 2018

Method of manufacturing physical quantity sensor device and physical quantity sensor device

Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Fumiya Ueno, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

John Fitzgerald

Assistant Examiner:

Rodney T Frank

Int. Cl.
CPC ...
G01P 15/125 (2006.01); G01F 1/684 (2006.01); G01F 1/692 (2006.01); F02D 41/18 (2006.01); G01F 5/00 (2006.01); G01F 15/14 (2006.01); G01L 19/00 (2006.01); G01L 9/00 (2006.01); G01L 19/14 (2006.01); G01P 1/02 (2006.01); G01P 15/12 (2006.01);
U.S. Cl.
CPC ...
G01P 15/125 (2013.01); F02D 41/18 (2013.01); G01F 1/684 (2013.01); G01F 1/6842 (2013.01); G01F 1/692 (2013.01); G01F 5/00 (2013.01); G01F 5/005 (2013.01); G01F 15/14 (2013.01); G01L 9/005 (2013.01); G01L 9/0054 (2013.01); G01L 19/0069 (2013.01); G01L 19/0084 (2013.01); G01L 19/142 (2013.01); G01L 19/147 (2013.01); G01P 1/023 (2013.01); G01P 15/123 (2013.01);
Abstract

An inner housing part has through-holes for connecting first lead pins (power supply terminal, output terminal, ground terminal) with the connector pins. The inner housing part has grooves that house second lead pins for adjusting output signals of a sensor chip. Three of the grooves each has a shape in which a distance between opposing sides of the groove is less than a diameter of the second lead pin that corresponds to the groove. The inner housing part is fixed to a case by a thermoset adhesive so as to house lead pins arranged in the case included in a sensor element. The second lead pins are fitted in the grooves, suppressing lifting of the inner housing part during curing of the adhesive.

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