The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Oct. 22, 2018
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Salvatore Cascino, Gravina di Catania, IT;

Antonello Santangelo, Belpasso, IT;

Assignee:

STMICROELECTRONICS S.R.L., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/12 (2006.01); H05B 3/02 (2006.01); H05B 3/20 (2006.01); H05B 3/10 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
G01N 27/128 (2013.01); B81C 1/00 (2013.01); H05B 3/02 (2013.01); H05B 3/10 (2013.01); H05B 3/20 (2013.01); G01N 27/123 (2013.01); H05B 2203/002 (2013.01); H05B 2203/013 (2013.01);
Abstract

A micro-heater element for a MEMS sensor device, envisages, in a single conductive layer: an outer ring, defining inside it a window; a heat-diffusion structure, arranged within the window, separated from the outer ring by a first separation gap; and connection elements, arranged between the heat-diffusion structure and the outer ring, and designed to connect the heat-diffusion structure to the outer ring. The outer ring is designed to dissipate energy upon passage of an electric current, and the heat-diffusion structure is designed to distribute, within the micro-heater element, the heat that is transferred by the outer ring through the connection elements.


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