The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Nov. 02, 2016
Applicant:
The Nanosteel Company, Inc., Providence, RI (US);
Inventors:
Charles D. Tuffile, Dighton, MA (US);
Harald Lemke, Northport, NY (US);
Patrick E. Mack, Milford, MA (US);
Assignee:
The NanoSteel Company, Inc., Providence, RI (US);
Primary Examiner:
Int. Cl.
CPC ...
C22C 38/58 (2006.01); B23K 15/00 (2006.01); B23K 26/00 (2014.01); B23K 26/342 (2014.01); B33Y 10/00 (2015.01); B33Y 70/10 (2020.01); B33Y 80/00 (2015.01); C22C 38/04 (2006.01); C22C 38/34 (2006.01); C22C 38/54 (2006.01); B22F 3/105 (2006.01); C21D 6/00 (2006.01); C21D 1/26 (2006.01); C21D 1/32 (2006.01); C22C 38/02 (2006.01); C21D 6/02 (2006.01); C22C 33/02 (2006.01); B22F 3/00 (2006.01); B33Y 70/00 (2020.01); B23K 101/20 (2006.01); B23K 103/04 (2006.01); B23K 103/10 (2006.01); B23K 101/04 (2006.01); B23K 101/06 (2006.01); B23K 101/10 (2006.01); B23K 101/12 (2006.01); B22F 3/24 (2006.01); B22F 7/04 (2006.01); B22F 7/06 (2006.01);
U.S. Cl.
CPC ...
C22C 38/58 (2013.01); B22F 3/008 (2013.01); B22F 3/1055 (2013.01); B23K 15/0086 (2013.01); B23K 15/0093 (2013.01); B23K 26/342 (2015.10); C21D 1/26 (2013.01); C21D 1/32 (2013.01); C21D 6/004 (2013.01); C21D 6/02 (2013.01); C22C 33/0257 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/34 (2013.01); C22C 38/54 (2013.01); B22F 7/06 (2013.01); B22F 2003/248 (2013.01); B22F 2007/042 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B23K 2101/045 (2018.08); B23K 2101/06 (2018.08); B23K 2101/10 (2018.08); B23K 2101/12 (2018.08); B23K 2101/20 (2018.08); B23K 2103/04 (2018.08); B23K 2103/05 (2018.08); B23K 2103/10 (2018.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); C21D 2201/03 (2013.01); C21D 2211/001 (2013.01); C21D 2211/004 (2013.01); C21D 2251/02 (2013.01); C21D 2251/04 (2013.01); C22C 33/0285 (2013.01); C22C 33/0292 (2013.01);
Abstract
The present disclosure is directed at alloys and method for layer-by-layer deposition of metallic alloys on a substrate to produce a metallic part. Applications for the metallic parts include pumps, pump parts, valves, molds, bearings, cutting tools, filters or screens.