The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Apr. 08, 2019
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Hiroki Oishi, Annaka, JP;
Shoichi Osada, Annaka, JP;
Ryuhei Yokota, Annaka, JP;
Munenao Hirokami, Annaka, JP;
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/62 (2006.01); H01L 23/29 (2006.01); C08L 63/00 (2006.01); C09J 163/00 (2006.01); C09D 163/04 (2006.01); C08G 59/32 (2006.01); C08G 59/24 (2006.01); C08K 5/544 (2006.01); C09D 163/00 (2006.01); C09D 7/63 (2018.01); C08K 5/3475 (2006.01);
U.S. Cl.
CPC ...
C09D 163/04 (2013.01); C08G 59/245 (2013.01); C08G 59/3218 (2013.01); C08G 59/621 (2013.01); C08K 5/3475 (2013.01); C08K 5/544 (2013.01); C09D 7/63 (2018.01); C09D 163/00 (2013.01); H01L 23/293 (2013.01); C08K 2201/014 (2013.01);
Abstract
An epoxy resin composition comprising an epoxy resin, a curing agent, (A) a carboxyl-containing benzotriazole derivative, and (B) an alkoxysilyl-containing aminoalkylsilane derivative is suited for encapsulating semiconductor devices. The sum of (A)+(B) is 0.5-5.0 pbw per 100 pbw of the sum of the epoxy resin and the curing agent, and a molar ratio (A)/(B) is 0.5-1.5. The composition is free of sulfur and highly adhesive to metal substrates.