The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Apr. 09, 2020
Applicant:

Hitachi Metals, Ltd., Tokyo, JP;

Inventors:

Shingo Ashihara, Tokyo, JP;

Hirotaka Yasaki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 23/08 (2006.01); H01B 3/44 (2006.01); H01B 7/02 (2006.01); C08K 3/22 (2006.01); C08K 9/04 (2006.01); C08K 3/013 (2018.01);
U.S. Cl.
CPC ...
C08L 23/0853 (2013.01); C08L 23/0815 (2013.01); H01B 3/446 (2013.01); H01B 7/0275 (2013.01); C08K 3/013 (2018.01); C08K 9/04 (2013.01); C08K 2003/2227 (2013.01); C08L 2203/202 (2013.01); C08L 2205/02 (2013.01);
Abstract

An insulated electric wire includes a conductor and an insulating layer. This insulating layer is made of a resin composition containing a base polymer and a metallic hydroxide. The base polymer contains ethylene-vinyl acetate copolymer and ethylene-(α-olefin) copolymer. The 'α-olefin' is a non-polarized monomer, its melting point is equal to or lower than 70° C. A vinyl-acetate total content of the base polymer is equal to or less than 19 mass %. The resin composition contains the ethylene-(α-olefin) copolymer, a content of which is equal to or more than 20 parts by mass and equal to or less than 70 parts by mass per 100 parts by mass of the base polymer, and contains the metallic hydroxide, a content of which is equal to or more than 30 parts by mass and equal to or less than 150 parts by mass per 100 parts by mass of the base polymer.


Find Patent Forward Citations

Loading…