The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 01, 2020

Filed:

Sep. 25, 2019
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Ikuya Miyazawa, Yamagata-Mura, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); B41J 2/155 (2006.01); B41J 2/14 (2006.01); B41J 2/055 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1623 (2013.01); B41J 2/055 (2013.01); B41J 2/14201 (2013.01); B41J 2/155 (2013.01); B41J 2/161 (2013.01); B41J 2002/14241 (2013.01);
Abstract

A liquid ejecting head including a first substrate in which a drive element that ejects a liquid from a nozzle, and a first wire electrically coupled to the drive element are formed, a second substrate in which an opposing surface that opposes the first substrate is adhered to the first substrate with an adhesive agent, a second wire being formed in the second substrate, and a protrusion configured to elastically deform, the protrusion being formed between the first substrate and the second substrate and electrically coupling the first wire and the second wire to each other. In the liquid ejecting head, a swelling ratio of the protrusion is larger than a swelling ratio of the adhesive agent.


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