The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Apr. 20, 2016
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Chien-Hua Chen, Corvallis, OR (US);
Qin Liu, Corvallis, OR (US);
Michael G. Monroe, Corvallis, OR (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/165 (2017.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 30/00 (2015.01); B29C 64/393 (2017.01); B29K 63/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/165 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 70/00 (2014.12); B29K 2063/00 (2013.01);
Abstract
In a three-dimensional printing method example, an epoxy mold compound build material is applied. A fusing agent is selectively applied on at least a portion of the epoxy mold compound build material. The epoxy mold compound build material is exposed to energy, thereby fusing the portion of the epoxy mold compound build material in contact with the fusing agent to form a layer.