The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Sep. 02, 2015
Applicant:
Toshiba Memory Corporation, Tokyo, JP;
Inventors:
Yukiteru Matsui, Aichi, JP;
Takahiko Kawasaki, Aichi, JP;
Akifumi Gawase, Mie, JP;
Shuji Suzuki, Mie, JP;
Tsutomu Miki, Mie, JP;
Assignee:
Toshiba Memory Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/005 (2012.01); G01N 29/14 (2006.01); G01N 29/44 (2006.01); G01N 29/46 (2006.01);
U.S. Cl.
CPC ...
B24B 37/0053 (2013.01); G01N 29/14 (2013.01); G01N 29/4436 (2013.01); G01N 29/46 (2013.01); G01N 2291/2697 (2013.01);
Abstract
In accordance with an embodiment, a manufacturing method of a semiconductor device includes detecting elastic waves, and detecting or predicting an abnormality of the processing object occurring during polishing of the processing object. The elastic waves are generated from the processing object during the polishing. The abnormality is detected or predicted by analyzing the detected elastic waves.