The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2020

Filed:

Apr. 11, 2018
Applicant:

Ntrium Inc., Suwon, KR;

Inventors:

Se Young Jeong, Suwon, KR;

Ki Su Joo, Suwon, KR;

Ju Young Lee, Suwon, KR;

Jeong Woo Hwang, Suwon, KR;

Jin Ho Yoon, Suwon, KR;

Assignee:

NTRIUM INC., Suwon-si, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H01L 23/552 (2006.01); H01L 23/31 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0088 (2013.01); H01L 23/3135 (2013.01); H01L 23/552 (2013.01); H05K 1/095 (2013.01); H05K 1/186 (2013.01); H05K 3/4644 (2013.01); H05K 9/0024 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H05K 3/467 (2013.01); H05K 3/4664 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/083 (2013.01); Y10T 29/49146 (2015.01);
Abstract

Provided is an electronic component package for electromagnetic interference shielding. The electronic component package for electromagnetic interference shielding according to an embodiment of the present invention comprises a substrate where electronic components are mounted, a molding member formed on the substrate and the electronic components, a magnetic layer formed on the molding member, and a conductive layer formed on the magnetic layer. Electromagnetic waves generated from the electronic components embeded in the molding member are absorbed in the magnetic layer to thus prevent or reduce harmful influence on other electronic components mounted in adjacent places. In addition, harmful electromagnetic waves generated from the outside may be shielded due to the conductive layer formed on the magnetic layer, thereby protecting electronic components embeded in the molding member from being influenced by the electromagnetic waves.


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