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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10849257 B1

PDFFull Text
Date of Patent:
Nov. 24, 2020

Filed:

May. 31, 2019

Module

Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventor:

Shin Furuya, Kyoto, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Pearne & Gordon, LLP

Primary Examiner:

Daniel P Wicklund

Assistant Examiner:

Sagar Shrestha

Int. Cl.
CPC ...
H05K 9/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H05K 1/18 (2006.01); H05K 5/06 (2006.01); H01L 23/28 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0022 (2013.01); H01L 23/00 (2013.01); H01L 23/28 (2013.01); H01L 23/3121 (2013.01); H01L 23/538 (2013.01); H01L 23/552 (2013.01); H01L 25/065 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H05K 1/181 (2013.01); H05K 5/064 (2013.01); H05K 5/065 (2013.01); H05K 9/0037 (2013.01); H01L 25/16 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10545 (2013.01);
Abstract

A first trench is formed in a first sealing resin layer, which seals first electronic components and second electronic components on one main surface of a circuit board, and a second trench is formed in a second sealing resin layer, which seals third electronic components and fourth electronic components on another main surface. The first trench is formed between the first electronic components and the second electronic components when viewed in plan view, extending from an upper surface of the first sealing resin layer toward a surface opposite from the one main surface of the first sealing resin layer, and the second trench is formed between the third electronic components and the fourth electronic components when viewed in plan view, extending from a lower surface of the second sealing resin layer toward a surface opposite from the other main surface of the second sealing resin layer.

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Furuya, Shin. (2020). Module (U.S. Patent No. 10849257). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10849257

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