The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2020

Filed:

Apr. 11, 2018
Applicant:

Siemens Aktiengesellschaft, Munich, DE;

Inventor:

Stefan Pfefferlein, Heroldsberg, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28D 7/10 (2006.01); F04D 29/58 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); F04D 29/586 (2013.01); F04D 29/5806 (2013.01); F28D 7/10 (2013.01); H05K 7/20154 (2013.01); H05K 7/20163 (2013.01); H05K 7/20263 (2013.01); H05K 7/20272 (2013.01); H05K 7/20927 (2013.01);
Abstract

A cooling apparatus for cooling an electronic component includes a heat sink, a heat sink cover to close a top area opening of the heat sink, a tube-shaped cooling element arranged inside the heat sink for some cooling ribs of the heat sink in mechanical contact with an outer side of the tube-shaped cooling element, and an impeller with blades for generating a cooling flow of a cooling medium. The tube-shaped cooling element forms a first cooling duct to conduct the cooling flow in a first cooling flow direction. A second cooling duct opposite the first cooling duct is formed between an inner area of the heat sink and the outer side of the tube-shaped cooling element to conduct the cooling flow in a second cooling flow direction. The cooling flow is redirected from the first cooling duct to the second cooling duct or vice versa.


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