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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10849235 B1

PDFFull Text
Date of Patent:
Nov. 24, 2020

Filed:

May. 20, 2020

Method of manufacture of a structure and structure

Applicant:

Tactotek Oy, Oulunsalo, FI;

Inventors:

Tomi Simula, Oulunsalo, FI;

Mika Paani, Oulunsalo, FI;

Miikka Kärnä, Oulunsalo, FI;

Outi Rusanen, Oulunsalo, FI;

Johanna Juvani, Oulunsalo, FI;

Tapio Rautio, Oulunsalo, FI;

Marko Suo-Anttila, Oulunsalo, FI;

Mikko Heikkinen, Oulunsalo, FI;

Assignee:

TACTOTEK OY, Oulunsalo, FI;

Attorneys:

Robert P. Michal, Esq.

Carter, DeLuca & Farrell LLP

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01); H05K 3/28 (2006.01); H05K 3/32 (2006.01); H05K 3/46 (2006.01); H01L 21/00 (2006.01); H01L 21/12 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 21/56 (2006.01); H01L 21/67 (2006.01); H01L 23/14 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/50 (2006.01); H01L 23/52 (2006.01); H01L 23/498 (2006.01); H05K 5/03 (2006.01); H05K 5/06 (2006.01); B29C 45/14 (2006.01); B29K 101/12 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); B29C 45/14819 (2013.01); H05K 1/181 (2013.01); H05K 5/03 (2013.01); H05K 5/065 (2013.01); B29K 2101/12 (2013.01); B29L 2031/3406 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01);
Abstract

A method of manufacture of a structure includes obtaining or producing a functional electronics assembly including at least a first substrate, at least one electronics component on the first substrate, and at least one connection portion, providing the functional electronics assembly on a first substrate film, wherein the functional electronics assembly is connected to the first substrate film via the at least one connection portion, and providing first material to at least partly embed the at least one electronics component into the first material. The first substrate film is adapted to include a recess defining a volume, and the at least one electronics component is arranged at least partly in the volume.

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