The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2020

Filed:

Mar. 27, 2014
Applicant:

Toppan Forms Co., Ltd., Tokyo, JP;

Inventor:

Akihito Mori, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/32 (2006.01); B32B 15/00 (2006.01); H05K 3/10 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); H01L 23/498 (2006.01); C09D 11/52 (2014.01); C09J 169/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); B32B 15/00 (2013.01); C09D 11/52 (2013.01); C09J 169/00 (2013.01); H01L 23/49883 (2013.01); H05K 1/09 (2013.01); H05K 1/092 (2013.01); H05K 3/105 (2013.01); H05K 3/321 (2013.01); B32B 2457/08 (2013.01); H01L 2924/0002 (2013.01); H05K 1/097 (2013.01); H05K 3/1208 (2013.01); H05K 2201/06 (2013.01); H05K 2201/10636 (2013.01); H05K 2203/1157 (2013.01); H05K 2203/121 (2013.01); Y02P 70/611 (2015.11);
Abstract

Provided are a laminate including a silver layer on a substrate, in which the silver layer includes a surface in which Kurtosis of a roughness curve satisfies at least one of Condition (i) the change rate of Kurtosis is greater than or equal to 50% under conditions of a temperature of 85° C. and a relative humidity of 85% after 240 hours have elapsed and Condition (ii) the change rate of Kurtosis is greater than or equal to 200% under conditions of a temperature of 85° C. and a relative humidity of 85% after 480 hours have elapsed, and a circuit board in which an electronic component is mounted on the surface of the laminate through a conductive joint portion.


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