The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Jan. 09, 2019
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
Hongqisheng Precision Electronics (Qinhuangdao) Co., Ltd., Qinhuangdao, CN;
Rui-Wu Liu, Huaian, CN;
Ming-Jaan Ho, New Taipei, TW;
Lei Zhou, Shenzhen, CN;
Man-Zhi Peng, Huaian, CN;
Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;
HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Qinhuangdao, CN;
Abstract
A method for manufacturing a printed circuit board (PCB) with high component density includes at least two reinforcing plates, at least two connecting plates, a first circuit board unit, and a second circuit board unit. The reinforcing plate includes a supporting portion, a first connecting portion, and a second connecting portion. The first connecting portion and the second connecting portion connect to ends of the supporting portion. The connecting plates are bendable circuit boards. Each connecting plate is attached to the supporting portion, the first connecting portion, and the second connecting portion of a reinforcing plate. The first circuit board unit is fixed and electrically connected to a connecting plate away from first connecting portion. The second circuit board unit is fixed and electrically connected to a connecting plate away from the second connecting portion.