The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2020

Filed:

Jul. 07, 2020
Applicant:

Telephonies Corporation, Farmingdale, NY (US);

Inventors:

George McPartland, Massapequa, NY (US);

Aleksander Vaysman, Brooklyn, NY (US);

Assignee:

Telephonics Corporation, Farmingdale, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 7/02 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); H05K 1/0203 (2013.01); H05K 7/02 (2013.01); H05K 1/0272 (2013.01);
Abstract

A stacked electronic arrangement provides independent upgradability of active component boards and radiator boards, enabling quick changes in chip set and alternate polarizations, and includes: an active tile circuit card assembly (CCA); a passive radiator CCA; a tile frame; and a heat exchanger. The active tile CCA includes transmit/receive modules that accept, amply and transmit radar signals. The passive radiator CCA includes patch radiator plugins that receive and then radiate the amplified signal from the modules. The tile frame separates the active tile and the passive radiator CCAs. An elongated casing of the heat exchanger creates an accommodating space for air flow, and forms a first inlet, a second inlet, and a central exhaust plenum between the first and second inlets. High density fins are positioned within the accommodating space between the first and second inlets, and which have openings to the exhaust outlet.


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