The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Nov. 14, 2017
Applicant:
Pioneer Circuits, Inc., Santa Ana, CA (US);
Inventors:
Dale McKeeby, Orange, CA (US);
Robert Lee, Newport Beach, CA (US);
Assignee:
PIONEER CIRCUITS, INC., Santa Ana, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 1/09 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/038 (2013.01); H05K 1/0201 (2013.01); H05K 1/0393 (2013.01); H05K 1/09 (2013.01); H05K 3/285 (2013.01); H05K 3/4655 (2013.01); H05K 1/0281 (2013.01); H05K 1/0366 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/029 (2013.01); H05K 2201/09027 (2013.01); H05K 2203/0108 (2013.01); H05K 2203/0113 (2013.01);
Abstract
Provided herein are embodiments of a PWB circuit construction material, and its use in flexible PWB circuits. The PWB circuit construction material is made up of temperature resistant fabric bonded to a metal substrate using a bonding agent. The temperature resistant material may include synthetic aromatic polyamide fibers. The fabric may be used as a reinforcement for the standard PWB construction materials for flexible PWB circuits and as a standalone piece that is bonded as a hinge at rigid portions of a rigid or rigid-flexible PWB circuit to reduce the thermal effects.