The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2020

Filed:

Sep. 21, 2018
Applicant:

Analog Devices Global Unlimited Company, Hamilton, BM;

Inventors:

Ying Zhao, Andover, MA (US);

Alan O'Donnell, Castletroy, IE;

Michael James Twohig, Cork, IE;

Olly J. Kierse, Killaloe, IE;

James Thomas Sheeran, Abbeyleix, IE;

Michael C. W. Coln, Lexington, MA (US);

Paul W. Stevens, Andover, MA (US);

Bruce A. Hecht, Brookline, MA (US);

Padraig Fitzgerald, Mallow, IE;

Mark Schirmer, Sunapee, NH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H03K 17/94 (2006.01); H01H 59/00 (2006.01);
U.S. Cl.
CPC ...
H03K 17/943 (2013.01); H01H 59/0009 (2013.01); H01L 25/167 (2013.01);
Abstract

Optically isolated micromachined (MEMS) switches and related methods are described. The optically isolated MEMS switches described herein may be used to provide isolation between electronic devices. For example, the optically isolated MEMS switches of the types described herein can enable the use of separate grounds between the receiving electronic device and the control circuitry. Isolation of high-voltage signals and high-voltage power supplies can be achieved by using an optical isolator and a MEMS switch, where the optical isolator controls the state of the MEMS switch. In some embodiments, utilizing optical isolators to provide high voltages, the need for electric high-voltage sources such as high-voltage power supplies and charge pumps may be removed, thus removing the cause of potential damage to the receiving electronic device. In one example, the optical isolator and the MEMS switch may be co-packaged on the same substrate.


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