The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2020

Filed:

Oct. 31, 2017
Applicant:

Showa Denko Packaging Co., Ltd., Kanagawa, JP;

Inventors:

Kenji Yoshino, Kanagawa, JP;

Makoto Karatsu, Kanagawa, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01M 2/08 (2006.01); H01M 2/02 (2006.01); H01M 10/00 (2006.01);
U.S. Cl.
CPC ...
H01M 2/08 (2013.01); H01M 2/02 (2013.01); H01M 2/0275 (2013.01); H01M 2/0277 (2013.01); H01M 2/0285 (2013.01); H01M 2/0287 (2013.01); H01M 10/00 (2013.01); H01M 2002/0297 (2013.01);
Abstract

A packaging material for a power storage device includes a heat resistant resin layeras an outer layer, a sealant layeras an inner layer, and a metal foil layerarranged between these layers. The sealant layeris composed of one layer or a plurality of layers. The innermost layerof the sealant layer contains a random copolymer containing propylene as a copolymerization component and another copolymerization component other than propylene, a roughening material, and a lubricant. The roughening material is composed of particles containing a thermoplastic resin. The center line average roughness Ra of the surfaceof the innermost layeris 0.05 μm to 1 μm. It can provide a packaging material for a power storage device which is excellent in formability and hard to generate white powder on the surface.


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