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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10847758 B1

PDFFull Text
Date of Patent:
Nov. 24, 2020

Filed:

Jul. 22, 2016

Method for releasing resin film and method for manufacturing organic el display device

Applicant:

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Katsuhiko Kishimoto, Osaka, JP;

Kohichi Tanaka, Osaka, JP;

Assignee:

HON HAI PRECISION INDUSTRY CO., LTD., New Taipei, TW;

Attorney:

ScienBiziP, P.C.

Primary Examiner:

Caleb E Henry

Int. Cl.
CPC ...
H01L 29/08 (2006.01); H01L 51/56 (2006.01); H01L 21/67 (2006.01); H01L 51/00 (2006.01); H01L 27/12 (2006.01); B65H 29/56 (2006.01); H01L 27/32 (2006.01); H01L 29/786 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H01L 51/56 (2013.01); B65H 29/56 (2013.01); H01L 21/6715 (2013.01); H01L 21/67132 (2013.01); H01L 27/1214 (2013.01); H01L 27/1218 (2013.01); H01L 27/1266 (2013.01); H01L 27/3241 (2013.01); H01L 29/78603 (2013.01); H01L 51/003 (2013.01); H01L 51/0097 (2013.01); B65H 2301/44338 (2013.01); B65H 2801/61 (2013.01); H01L 51/5253 (2013.01);
Abstract

A resin film is released from a supporting substrate without using light irradiation, with ease, and without damaging the resin film or the like. Preparation for separating the supporting substrate on which the resin film is cohesively formed into a first part and a second part; and at least one of the first part and the second part is allowed or caused to move in a direction parallel to an one surface of the first part while the first part of the supporting substrate and at least an edge of the second part facing the first part being moved with respect to one another, while a close contact between the resin film and an one surface of the second part of the supporting substrate being maintained, such that the first part and the edge of the second part are separated along a perpendicular direction to the one surface of the first part.

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