The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Aug. 01, 2019
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD., Kyoto, JP;
Abstract
In a semiconductor device including first and second conductive plates (FFPs) formed by being stacked in layer, the first conductive plate and the second conductive plate include linear regions elongated to face each other along a longitudinal direction in which a length with which source region and drain region elongated in parallel face each other is longest, and are elongated in a short-side direction orthogonal to the longitudinal direction. Here, high voltage wiring of either one of source wiring and drain wiring is elongated in the short-side direction to intersect the linear regions of the first conductive plate and the second conductive plate, and low voltage wiring of the other one of source wiring and drain wiring is elongated in the short-side direction to intersect at least one linear region of the first conductive plate or the second conductive plate.