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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10847504 B1

PDFFull Text
Date of Patent:
Nov. 24, 2020

Filed:

Apr. 25, 2019

Micro-led module and method for fabricating the same

Applicant:

Lumens Co., Ltd., Yongin-si, KR;

Inventors:

Taekyung Yoo, Yongin-si, KR;

Daewon Kim, Yongin-si, KR;

Seongbok Yoon, Yongin-si, KR;

Yelim Won, Yongin-si, KR;

Myungji Moon, Yongin-si, KR;

Hanbeet Chang, Yongin-si, KR;

Yongpil Kim, Yongin-si, KR;

Jaesoon Park, Yongin-si, KR;

Assignee:

LUMENS CO., LTD., Yongin-si, KR;

Attorney:

Mei & Mark LLP

Primary Examiner:

Igwe U Anya

Int. Cl.
CPC ...
H01L 33/38 (2010.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 33/32 (2010.01); H01L 33/42 (2010.01); H01L 25/16 (2006.01); H01L 23/00 (2006.01); H01L 27/092 (2006.01); H01L 27/15 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 33/007 (2013.01); H01L 33/38 (2013.01); H01L 27/092 (2013.01); H01L 27/156 (2013.01); H01L 33/32 (2013.01); H01L 33/42 (2013.01); H01L 33/62 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/1181 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13611 (2013.01); H01L 2224/13639 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81224 (2013.01); H01L 2224/81365 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/81986 (2013.01); H01L 2924/014 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.

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