The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Sep. 21, 2018
Applicant:
Socionext Inc., Yokohama, JP;
Inventors:
Masanobu Hirose, Yokohama, JP;
Toshihiro Nakamura, Yokohama, JP;
Assignee:
SOCIONEXT INC., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 27/02 (2006.01); H01L 23/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5286 (2013.01); H01L 23/50 (2013.01); H01L 27/0248 (2013.01); H01L 27/0292 (2013.01);
Abstract
Disclosed herein is a semiconductor integrated circuit device which can ensure sufficient power supply ability and ESD protection capability for an I/O cell without increasing the area of the semiconductor integrated circuit. In-row power supply interconnects (to) provided in I/O cell rows (A,B) are connected to a power supply interconnect () provided between the I/O cell rows (A,B) via power supply interconnects (to). The power supply interconnect () is thicker than the in-row power supply interconnects (to).