The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2020

Filed:

May. 22, 2017
Applicant:

Delta Electronics (Shanghai) Co., Ltd, Shanghai, CN;

Inventors:

Guodong Yin, Shanghai, CN;

Jinfa Zhang, Shanghai, CN;

Haijun Yang, Shanghai, CN;

Ben Wu, Shanghai, CN;

Lei Cai, Shanghai, CN;

Zhongwei Ke, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 17/04 (2006.01); H01L 23/522 (2006.01); H05K 1/16 (2006.01); H01F 27/28 (2006.01); H01L 23/528 (2006.01); H01L 23/64 (2006.01); H05K 7/14 (2006.01); H05K 1/02 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5227 (2013.01); H01F 27/2804 (2013.01); H01L 23/5286 (2013.01); H01L 23/645 (2013.01); H05K 1/165 (2013.01); H05K 7/1457 (2013.01); H01F 2027/2809 (2013.01); H01F 2027/2819 (2013.01); H01L 28/10 (2013.01); H05K 1/0265 (2013.01); H05K 2201/086 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/1028 (2013.01); H05K 2201/10287 (2013.01);
Abstract

A power module and a power device having the power module are disclosed. The power device includes a main board. The power module is inserted in the main board and includes a PCB, a magnetic element, a primary winding circuit and at least one secondary winding circuit. The magnetic element is provided on the PCB and includes a core structure, a primary winding and at least one secondary winding. The core structure has a first side and a second side opposite to each other, and a third side and a fourth side opposite to each other. The primary winding circuit is provided on the PCB and positioned in the vicinity of the first or second side of the core structure. The secondary winding circuit is provided on the PCB and positioned in the vicinity of the third or fourth side of the core structure.


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