The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Mar. 01, 2019
Applicant:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Inventors:
Hisao Miyazaki, Yokohama, JP;
Tadashi Sakai, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Minato-ku, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 29/16 (2006.01); H01L 29/51 (2006.01); H01L 29/786 (2006.01); H01L 29/04 (2006.01); H01L 21/04 (2006.01); H01L 21/762 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02488 (2013.01); H01L 21/0228 (2013.01); H01L 21/0262 (2013.01); H01L 21/02145 (2013.01); H01L 21/02164 (2013.01); H01L 21/02175 (2013.01); H01L 21/02178 (2013.01); H01L 21/02181 (2013.01); H01L 21/02381 (2013.01); H01L 21/02433 (2013.01); H01L 21/02516 (2013.01); H01L 21/02527 (2013.01); H01L 21/02609 (2013.01); H01L 21/041 (2013.01); H01L 21/043 (2013.01); H01L 21/7624 (2013.01); H01L 29/045 (2013.01); H01L 29/1602 (2013.01); H01L 29/513 (2013.01); H01L 29/517 (2013.01); H01L 29/66045 (2013.01); H01L 29/78603 (2013.01); H01L 29/78684 (2013.01); H01L 21/044 (2013.01);
Abstract
A laminated body of an embodiment includes: a silicon layer; a first beryllium oxide layer on the silicon layer; and a diamond semiconductor layer on the first beryllium oxide layer.