The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2020

Filed:

Feb. 22, 2017
Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Matthew Anthony Dilligan, Seattle, WA (US);

William B. H. Grace, Vashon, WA (US);

Brice Thompson Collamer, Mukilteo, WA (US);

Joe M. Walters, Everett, WA (US);

Randy Jay Grove, Tukwila, WA (US);

Assignee:

THE BOEING COMPANY, Chicago, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 3/56 (2006.01); B32B 7/14 (2006.01); B32B 3/12 (2006.01); G01M 5/00 (2006.01); B29C 65/00 (2006.01);
U.S. Cl.
CPC ...
G01N 3/56 (2013.01); B32B 3/12 (2013.01); B32B 7/14 (2013.01); G01M 5/0016 (2013.01); B29C 66/7254 (2013.01); B32B 2305/024 (2013.01); Y10T 156/10 (2015.01); Y10T 428/24149 (2015.01);
Abstract

A test coupon having node bonds is disclosed. In some aspects, the method includes a first foil and a second foil, stripes of adhesive serially disposed across a width of the first foil or the second foil and coupling the first foil and second foil to one another to form node bonds, and a first adherend coupled to the first foil and a second adherend coupled to the second foil such that the first foil and the second foil are provided between the first adherend and the second adherend, the first adherend and the second adherend being connectable to load blocks of a test apparatus capable of loading the test coupon to determine characteristics of each of the node bonds formed from the stripes of adhesive. A method for testing node bonds and a related apparatus are also disclosed.


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