The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2020

Filed:

May. 04, 2016
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Daniel D. Sunshine, Sunnyvale, CA (US);

Daniel A. Podhajny, San Jose, CA (US);

David M. Kindlon, Lake Arrowhead, CA (US);

Kathryn P. Crews, San Francisco, CA (US);

Joseph B. Walker, Saratoga, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
D03D 15/00 (2006.01); D03D 1/00 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
D03D 15/00 (2013.01); D03D 1/0082 (2013.01); D03D 1/0088 (2013.01); H05K 1/038 (2013.01); H05K 1/0393 (2013.01); H05K 1/09 (2013.01); H05K 1/111 (2013.01); H05K 3/0011 (2013.01); H05K 3/10 (2013.01); H05K 3/103 (2013.01); D10B 2101/20 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0158 (2013.01);
Abstract

An item may include fabric or other materials formed from intertwined strands of material. The item may include circuitry that produces signals. The strands of material may include non-conductive strands and conductive strands. The conductive strands may carry the signals produced by the circuitry. Each conductive strand may have a strand core, a conductive coating on the strand core, and an insulating layer on the conductive coating. The strand cores may be strands formed from polymer. The conductive coating may be formed from metal. Electrical connections may be made between intertwined conductive strands by selectively removing portions of the outer insulating layer to expose the conductive cores of overlapping conductive strands. A conductive material such as solder or conductive epoxy may be applied to the exposed portions of the conductive cores to electrically and mechanically connect the overlapping conductive strands.


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