The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2020

Filed:

Sep. 07, 2018
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Yuichi Kasuya, Haibara-gun, JP;

Hisashi Hotta, Haibara-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25F 3/14 (2006.01); C25D 11/24 (2006.01); C25F 3/04 (2006.01); H01M 4/66 (2006.01); C25D 11/18 (2006.01); C25D 11/20 (2006.01); H01M 4/72 (2006.01); H01M 4/80 (2006.01); H01G 11/84 (2013.01); H01G 11/70 (2013.01); H01G 11/50 (2013.01); H01G 11/86 (2013.01); H01M 4/04 (2006.01); H01G 11/06 (2013.01); H01G 9/045 (2006.01); H01M 4/02 (2006.01); H01G 11/28 (2013.01);
U.S. Cl.
CPC ...
C25F 3/14 (2013.01); C25D 11/18 (2013.01); C25D 11/20 (2013.01); C25D 11/24 (2013.01); C25F 3/04 (2013.01); H01G 11/28 (2013.01); H01G 11/50 (2013.01); H01G 11/70 (2013.01); H01G 11/84 (2013.01); H01G 11/86 (2013.01); H01M 4/0438 (2013.01); H01M 4/661 (2013.01); H01M 4/667 (2013.01); H01M 4/72 (2013.01); H01M 4/80 (2013.01); H01G 9/045 (2013.01); H01G 11/06 (2013.01); H01M 2004/021 (2013.01);
Abstract

An object is to provide a method for manufacturing an aluminum plate having a plurality of through-holes in a thickness direction in which the locations of the through-holes are controlled and a manufacturing apparatus that is used in the method for manufacturing the aluminum plate. A method for manufacturing an aluminum plate of the present invention is a method for manufacturing an aluminum plate having a plurality of through-holes in a thickness direction, the method including a coating-forming step of forming a coating of an aluminum compound on a surface of an aluminum substrate having a thickness of 5 to 1,000 μm, a partial coating removal step of removing, out of the coating, the coating present on portions in which the through-holes need to be formed, and a through-hole-forming step of forming the through-holes in the aluminum substrate by carrying out an electrochemical melting treatment on the aluminum substrate after the partial coating removal step.


Find Patent Forward Citations

Kasuya, Yuichi. (2020). Method for manufacturing aluminum plate and apparatus for manufacturing aluminum plate (U.S. Patent No. 10844509). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10844509

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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