The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10844462 B1

Date of Patent:

Nov. 24, 2020

Filed:

Jun. 08, 2017

Slide material and method for manufacturing same, and slide member

Applicant:

Daido Metal Company Ltd., Aichi, JP;

Inventor:

Kazuaki Toda, Inuyama, JP;

Assignee:

DAIDO METAL COMPANY LTD., Nagoya, JP;

Attorney:

Snyder, Clark, Lesch & Chung, LLP

Primary Examiner:

Daniel J Schleis

Int. Cl.

CPC ...

C22C 9/00 (2006.01); B32B 15/01 (2006.01); B22D 19/16 (2006.01); F16C 33/12 (2006.01); F16C 33/14 (2006.01); B22D 27/04 (2006.01); C22C 9/05 (2006.01); C22C 1/02 (2006.01); C22C 9/01 (2006.01); C22C 9/06 (2006.01); C22C 9/10 (2006.01); B22D 13/02 (2006.01); C22C 9/02 (2006.01); B22D 19/00 (2006.01); C22C 1/00 (2006.01); C22C 9/04 (2006.01);

U.S. Cl.

CPC ...

C22C 9/00 (2013.01); B22D 13/02 (2013.01); B22D 19/00 (2013.01); B22D 19/16 (2013.01); B22D 27/04 (2013.01); B22D 27/045 (2013.01); B32B 15/015 (2013.01); C22C 1/00 (2013.01); C22C 1/02 (2013.01); C22C 9/01 (2013.01); C22C 9/02 (2013.01); C22C 9/04 (2013.01); C22C 9/05 (2013.01); C22C 9/06 (2013.01); C22C 9/10 (2013.01); F16C 33/12 (2013.01); F16C 33/121 (2013.01); F16C 33/14 (2013.01); F16C 2204/18 (2013.01);

Abstract

Provided are a slide material in which the joining strength between a Bi-containing copper alloy layer and a substrate is improved, and a method for manufacturing the slide material. The slide material according to the present invention has a substrate and a copper alloy layer. The copper alloy layer comprises a copper alloy containing 4.0-25.0 mass % of Bi and has a structure in which Bi phases are scattered in a copper alloy structure. The contact area ratio of Bi phases of the copper alloy layer at the joining interface with the substrate is not more than 2.0%. The slide material is manufactured by casting a molten copper alloy onto a substrate and causing the copper alloy to solidify unidirectionally.

Find Patent Forward Citations