The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2020

Filed:

Mar. 05, 2018
Applicant:

Otsuka Chemical Co., Ltd., Osaka, JP;

Inventors:

Shogo Kamada, Tokushima, JP;

Kazuhiro Tada, Tokushima, JP;

Emiko Daimon, Tokushima, JP;

Toshiaki Yagi, Tokushima, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C01G 23/00 (2006.01); C01F 11/46 (2006.01); C08L 63/04 (2006.01); F16D 69/02 (2006.01);
U.S. Cl.
CPC ...
C01G 23/005 (2013.01); C01F 11/462 (2013.01); C08L 63/04 (2013.01); F16D 69/02 (2013.01); C01P 2004/60 (2013.01); C01P 2006/12 (2013.01); C01P 2006/90 (2013.01);
Abstract

Provided is a friction material composition that can increase the coefficient of friction and the wear resistance, reduce the compressive deformation rate, and improve the yield upon hot forming, even when being free of copper component or having a small content of copper component. The friction material composition contains: titanate compound powder made of non-fibrous titanate compound particles; barium sulfate powder; and a thermosetting resin, wherein the titanate compound powder has an alkali metal ion dissolution rate of 15.0% by mass or less, the barium sulfate powder has a volume-based 50% cumulative particle diameter (D) of 0.1 μm toμm, and a content of copper component is 0.5% by mass or less in terms of copper element in a total amount of 100% by mass of the friction material composition.


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