The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 24, 2020

Filed:

Apr. 05, 2017
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Steffen Zunft, Reutlingen, DE;

Bonsang Kim, Mountain View, CA (US);

Ando Feyh, Reutlingen, DE;

Andrew Graham, Redwood City, CA (US);

Gary O'Brien, Palo Alto, CA (US);

Michael Baus, Bietigheim-Bissingen, DE;

Ralf Maier, Gerlingen, DE;

Mariusz Koc, Stuttgart, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0016 (2013.01); B81B 7/0048 (2013.01); B81C 1/00333 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2203/0163 (2013.01); B81B 2203/0315 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/0118 (2013.01);
Abstract

A micromechanical device having a substrate wafer, a functional layer situated above it which has a mobile micromechanical structure, and a cap situated on top thereof, having a first cavity, which is formed at least by the substrate wafer and the cap and which includes the micromechanical structure. The micromechanical device has a fixed part and a mobile part, which are movably connected to each other with at least one spring element, and the first cavity is situated in the mobile part. Also described is a method for producing the micromechanical device.


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