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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10843445 B1

PDFFull Text
Date of Patent:
Nov. 24, 2020

Filed:

Nov. 22, 2016

Matched-type electromagnetic wave absorber

Applicant:

Tomoegawa Co., Ltd., Tokyo, JP;

Inventors:

Takeshi Hashimoto, Shizuoka, JP;

Takuma Hattori, Shizuoka, JP;

Kojiro Tsuruta, Shizuoka, JP;

Assignee:

Tomoegawa Co., Ltd., Tokyo, JP;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Margaret G Moore

Int. Cl.
CPC ...
B32B 27/20 (2006.01); B32B 27/18 (2006.01); B32B 27/30 (2006.01); C09D 7/61 (2018.01); C09D 7/40 (2018.01); C09D 5/32 (2006.01); C09D 175/16 (2006.01); H05K 9/00 (2006.01); C08F 299/06 (2006.01); B32B 7/12 (2006.01); B32B 15/082 (2006.01); B32B 15/20 (2006.01); C09D 5/24 (2006.01); C09D 175/14 (2006.01); C08K 3/22 (2006.01);
U.S. Cl.
CPC ...
B32B 27/20 (2013.01); B32B 7/12 (2013.01); B32B 15/082 (2013.01); B32B 15/20 (2013.01); B32B 27/18 (2013.01); B32B 27/30 (2013.01); C08F 299/065 (2013.01); C09D 5/24 (2013.01); C09D 5/32 (2013.01); C09D 7/61 (2018.01); C09D 7/70 (2018.01); C09D 175/14 (2013.01); C09D 175/16 (2013.01); H05K 9/0081 (2013.01); H05K 9/0084 (2013.01); B32B 2307/40 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2241 (2013.01); C08K 2201/001 (2013.01); C08K 2201/016 (2013.01);
Abstract

A sheet-shaped matched-type electromagnetic wave absorber can obtain electromagnetic wave absorption performance with a relatively small thickness but has a problem that particularly a dimensional change in an electromagnetic wave absorption layer (resin composition layer) has a large influence on the electromagnetic wave absorption performance when being exposed to a high temperature. By laminating a resin composition layer in which a filler with an aspect ratio of 5 or more and a filler with an aspect ratio of less than 5 are dispersed and fixed with an electromagnetic wave reflection layer in a cured product of a resin composition containing an acrylic polymerizable resin and a polymerization initiator, it is possible to provide a matched-type electromagnetic wave absorber having high heat resistant dimensional stability and high electromagnetic wave absorption performance.

Find Patent Forward Citations

Hashimoto, Takeshi. (2020). Matched-type electromagnetic wave absorber (U.S. Patent No. 10843445). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10843445

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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