IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10843441 B1

PDFFull Text
Date of Patent:
Nov. 24, 2020

Filed:

Mar. 10, 2016

Electroactive polymers, methods of manufacture, and structures formed thereof

Applicant:

Purdue Research Foundation, West Lafayette, IN (US);

Inventors:

Gary W. Krutz, West Lafayette, IN (US);

Brittany Newell, Delphi, IN (US);

Assignee:

Purdue Research Foundation, West Lafayette, IN (US);

Attorneys:

Hartman Global IP Law

Gary M. Hartman

Domenica N. S. Hartman

Primary Examiner:

Betelhem Shewareged

Int. Cl.
CPC ...
B32B 25/08 (2006.01); B32B 37/14 (2006.01); B32B 38/00 (2006.01); B32B 25/20 (2006.01); B32B 27/16 (2006.01); B32B 27/26 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); H01L 41/047 (2006.01); H01L 41/09 (2006.01); B32B 27/08 (2006.01); H01L 41/29 (2013.01); H01L 41/193 (2006.01); H01B 5/14 (2006.01);
U.S. Cl.
CPC ...
B32B 25/08 (2013.01); B32B 25/20 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/26 (2013.01); B32B 27/285 (2013.01); B32B 27/288 (2013.01); B32B 27/304 (2013.01); B32B 27/322 (2013.01); B32B 37/144 (2013.01); B32B 38/164 (2013.01); H01B 5/14 (2013.01); H01L 41/0478 (2013.01); H01L 41/0986 (2013.01); H01L 41/193 (2013.01); H01L 41/29 (2013.01); B32B 2264/00 (2013.01); B32B 2307/202 (2013.01); B32B 2307/204 (2013.01); B32B 2457/00 (2013.01); H01L 41/047 (2013.01);
Abstract

Methods for producing layered structures that include a conductive polymeric layer and a dielectric polymeric layer. The dielectric polymeric layer can be formed by curing a first volume of a dielectric polymeric material. A second volume of the dielectric polymeric material is doped with conductive particulates to yield a conductive polymeric material, which is then partially cured and solvated to create a conductive polymeric paste. The paste is applied to a surface of the dielectric polymeric layer, dried, and cured to form a conductive polymeric layer on the pre-strained dielectric polymeric layer yielding a layered structure that includes the conductive polymeric layer and the dielectric polymeric layer. A pre-strain is induced in the dielectric polymeric material by contacting a chemical thereto that causes swelling therein.

Find Patent Forward Citations

Loading…