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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10843423 B1

PDFFull Text
Date of Patent:
Nov. 24, 2020

Filed:

Aug. 04, 2015

Specially-shaped epoxy resin molded article, and optical device provided with same

Applicant:

Daicel Corporation, Osaka, JP;

Inventors:

Takeshi Fujikawa, Himeji, JP;

Sadayuki Fukui, Himeji, JP;

Assignee:

DAICEL CORPORATION, Osaka, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Megan McCulley

Int. Cl.
CPC ...
B29D 11/00 (2006.01); G02B 3/08 (2006.01); B29C 39/02 (2006.01); G02B 5/02 (2006.01); G02B 1/04 (2006.01); B29C 39/00 (2006.01); C08G 59/24 (2006.01); C08G 59/22 (2006.01); C08K 5/134 (2006.01); C08K 5/527 (2006.01); B29L 11/00 (2006.01); B29K 63/00 (2006.01);
U.S. Cl.
CPC ...
B29D 11/00269 (2013.01); B29C 39/006 (2013.01); B29C 39/02 (2013.01); B29C 39/026 (2013.01); B29D 11/00442 (2013.01); C08G 59/226 (2013.01); C08G 59/24 (2013.01); C08K 5/1345 (2013.01); C08K 5/527 (2013.01); G02B 1/04 (2013.01); G02B 1/041 (2013.01); G02B 3/08 (2013.01); G02B 5/02 (2013.01); B29K 2063/00 (2013.01); B29K 2995/0082 (2013.01); B29L 2011/0016 (2013.01);
Abstract

Provided is a molded article that has such a shape as to offer a light condensing or light diffusing effect, has excellent mechanical strengths and heat resistance, and has a high thickness deviation ratio. This molded article includes a cured product of a curable composition containing an epoxy compound (A). The cured product has a flexural modulus of 2.5 GPa or more as measured in conformity with JIS K 7171:2008, except for performing measurement on a test specimen having a length of 20 mm, a width of 2.5 mm, and a thickness of 0.5 mm and at a span between specimen supports of 16 mm. The molded article has a thickness deviation ratio (thickest portion thickness to thinnest portion thickness ratio) of 5 or more and offers a light condensing or light diffusing effect. The molded article preferably has a thinnest portion thickness of 0.2 mm or less. The curable composition is preferably a photocurable composition.

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