The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Sep. 29, 2016
Applicant:
Origin Company, Limited, Saitama, JP;
Inventors:
Yukiko Hayashi, Saitama, JP;
Arisa Shiraishi, Saitama, JP;
Naoto Ozawa, Saitama, JP;
Takayuki Suzuki, Saitama, JP;
Assignee:
ORIGIN COMPANY, LIMITED, Saitama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 37/04 (2006.01); B23K 1/20 (2006.01); H01L 23/00 (2006.01); H05K 3/34 (2006.01); B23K 35/22 (2006.01); B23K 35/36 (2006.01); B23K 35/38 (2006.01); B23K 101/42 (2006.01); B23K 101/40 (2006.01); B23K 35/26 (2006.01);
U.S. Cl.
CPC ...
B23K 37/04 (2013.01); B23K 1/0016 (2013.01); B23K 1/20 (2013.01); B23K 1/203 (2013.01); B23K 35/22 (2013.01); B23K 35/36 (2013.01); B23K 35/3612 (2013.01); B23K 35/3613 (2013.01); B23K 35/383 (2013.01); H01L 24/29 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); H05K 3/34 (2013.01); B23K 35/262 (2013.01); B23K 2101/40 (2018.08); B23K 2101/42 (2018.08); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29113 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/7525 (2013.01); H01L 2224/75102 (2013.01); H01L 2224/75901 (2013.01); H01L 2224/83002 (2013.01); H01L 2224/8309 (2013.01); H01L 2224/83065 (2013.01); H01L 2224/83075 (2013.01); H01L 2224/83101 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/83948 (2013.01); H01L 2924/014 (2013.01);
Abstract
The present invention relates to a method for producing a soldered product by which soldering can be accomplished without using a jig. The method for producing a soldered product of the present invention comprises: