The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2020
Filed:
Nov. 18, 2015
Zkw Group Gmbh, Wieselburg, AT;
Erik Edlinger, Vienna, AT;
ZKW Group GmbH, Wieselburg, AT;
Abstract
The invention relates to a process to connect, by soldering, at least one electronic component () with a mounting plate (), the mounting plate having at least one mounting plate contact surface () and the at least one electronic component having at least one component contact surface () corresponding to it, the at least one mounting plate contact surface being surrounded by a solder resist layer () that borders the at least one mounting plate contact surface, the process having the following steps: a) Applying solder paste () onto at least areas of the solder resist layer (), minimally overlapping with the mounting plate contact surface () adjacent to the solder resist layer, b) Equipping the mounting plate with the at least one electronic component (), the at least one component contact surface () at least partly covering the at least one mounting plate contact surface () corresponding to it; and c) Heating the solder paste () to produce a soldered connection between the mounting plate and the at least one component.