The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2020
Filed:
Jun. 30, 2014
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventor:
Koichiro Tanaka, Ibaraki, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); C25D 7/06 (2006.01); B32B 15/01 (2006.01); C23C 28/00 (2006.01); B32B 15/08 (2006.01); C25D 5/10 (2006.01); C25D 5/50 (2006.01); C23C 28/02 (2006.01); C25D 5/12 (2006.01); B32B 15/20 (2006.01); B32B 15/04 (2006.01); B32B 15/18 (2006.01); C23C 30/00 (2006.01); C25D 1/04 (2006.01); C25D 3/56 (2006.01); C25D 3/12 (2006.01); C25D 3/20 (2006.01); C25D 3/30 (2006.01); C25D 3/38 (2006.01); C25D 3/22 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0088 (2013.01); B32B 15/01 (2013.01); B32B 15/013 (2013.01); B32B 15/015 (2013.01); B32B 15/017 (2013.01); B32B 15/018 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/08 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); C23C 28/00 (2013.01); C23C 28/02 (2013.01); C23C 28/021 (2013.01); C23C 28/023 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); C25D 5/10 (2013.01); C25D 5/12 (2013.01); C25D 5/50 (2013.01); C25D 5/505 (2013.01); C25D 7/06 (2013.01); C25D 7/0614 (2013.01); H05K 9/00 (2013.01); H05K 9/0081 (2013.01); H05K 9/0084 (2013.01); H05K 9/0098 (2013.01); C25D 1/04 (2013.01); C25D 3/12 (2013.01); C25D 3/20 (2013.01); C25D 3/22 (2013.01); C25D 3/30 (2013.01); C25D 3/38 (2013.01); C25D 3/562 (2013.01); Y10T 428/1266 (2015.01); Y10T 428/1291 (2015.01); Y10T 428/12431 (2015.01); Y10T 428/12438 (2015.01); Y10T 428/12569 (2015.01); Y10T 428/12611 (2015.01); Y10T 428/12618 (2015.01); Y10T 428/12681 (2015.01); Y10T 428/12687 (2015.01); Y10T 428/12694 (2015.01); Y10T 428/12708 (2015.01); Y10T 428/12715 (2015.01); Y10T 428/12792 (2015.01); Y10T 428/12799 (2015.01); Y10T 428/12861 (2015.01); Y10T 428/12868 (2015.01); Y10T 428/12875 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12889 (2015.01); Y10T 428/12896 (2015.01); Y10T 428/12903 (2015.01); Y10T 428/12917 (2015.01); Y10T 428/12924 (2015.01); Y10T 428/12931 (2015.01); Y10T 428/12937 (2015.01); Y10T 428/12944 (2015.01); Y10T 428/12951 (2015.01); Y10T 428/12958 (2015.01); Y10T 428/12972 (2015.01); Y10T 428/12979 (2015.01); Y10T 428/265 (2015.01); Y10T 428/27 (2015.01);
Abstract
A metal foil for electromagnetic shielding, comprising: a metal foil base having a thickness of exceeding 4 μm, an alloy layer having an A element configured of Sn or In and a B element group selected from the group consisting of one or more of Ag, Ni, Fe and Co formed on one or both surfaces of the base, and an underlayer having the B element group formed between the alloy layer and the base, wherein an adhesion amount of the A element is 10 to 300 μmol/dm, and a total adhesion amount of the B element group is 40 to 900 μmol/dm.