The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

Mar. 20, 2018
Applicant:

Quanta Computer Inc., Taoyuan, TW;

Inventors:

Chao-Jung Chen, Taoyuan, TW;

Yi-Chieh Chen, Taoyuan, TW;

Yueh-Chang Wu, Taoyuan, TW;

Yi-Ta Hsu, Taoyuan, TW;

Assignee:

QUANTA COMPUTER INC., Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20809 (2013.01); G06F 1/20 (2013.01); H05K 7/20727 (2013.01); G06F 2200/201 (2013.01); H05K 7/20172 (2013.01); H05K 7/20327 (2013.01); H05K 7/20436 (2013.01);
Abstract

A method and structure for improving efficiency of cooling and temperature uniformity among a plurality of heat generating electronic devices arranged in rows within a housing, such as a GPU server, utilizing a single source of cooling air. The electronic devices are arranged in a plurality of rows, but the heat sinks for the last row are elevated above the heat sinks of the first row so as to occupy different positions within the cooling air stream. In some embodiments the heat sinks of the electronic devices are extended forward so as to reside near the heat sinks of the electronic devices in the first row, but in a different flow path of cooling air. In other embodiments, a thermo siphon refrigeration system is provided for the electronic devices in the last row, and may be provided for the electronic devices in the first row as well.


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