The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 2020

Filed:

Sep. 23, 2019
Applicant:

Boyd Corporation, Pleasanton, CA (US);

Inventors:

Richard M. Hartman, Dallas, TX (US);

Paul J. Macioce, Milwaukee, WI (US);

Robert W. Tait, Plano, TX (US);

George H. Ransford, Magnolia, AR (US);

Assignee:

Boyd Corporation, Modesto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 13/00 (2006.01); H05K 7/20 (2006.01); B32B 15/20 (2006.01); B32B 27/28 (2006.01); B32B 27/06 (2006.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); B32B 15/09 (2006.01); B32B 27/36 (2006.01); B32B 9/04 (2006.01); B32B 27/32 (2006.01); B32B 15/085 (2006.01); B32B 15/095 (2006.01); B32B 5/02 (2006.01); B32B 5/24 (2006.01); B32B 15/14 (2006.01); B32B 7/14 (2006.01); B32B 27/40 (2006.01); B32B 5/18 (2006.01); B32B 7/12 (2006.01); B32B 9/00 (2006.01); B32B 27/34 (2006.01); F28F 21/02 (2006.01); F28F 21/06 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); B32B 5/02 (2013.01); B32B 5/18 (2013.01); B32B 5/245 (2013.01); B32B 7/12 (2013.01); B32B 7/14 (2013.01); B32B 9/007 (2013.01); B32B 9/041 (2013.01); B32B 9/045 (2013.01); B32B 9/046 (2013.01); B32B 9/047 (2013.01); B32B 15/043 (2013.01); B32B 15/046 (2013.01); B32B 15/08 (2013.01); B32B 15/085 (2013.01); B32B 15/09 (2013.01); B32B 15/095 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 27/06 (2013.01); B32B 27/065 (2013.01); B32B 27/281 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); F28F 13/003 (2013.01); F28F 21/02 (2013.01); F28F 21/067 (2013.01); B32B 2250/03 (2013.01); B32B 2255/10 (2013.01); B32B 2266/0214 (2013.01); B32B 2266/06 (2013.01); B32B 2266/08 (2013.01); B32B 2307/204 (2013.01); B32B 2307/206 (2013.01); B32B 2307/302 (2013.01); B32B 2307/304 (2013.01); B32B 2307/306 (2013.01); B32B 2307/308 (2013.01); B32B 2307/58 (2013.01); B32B 2307/5825 (2013.01); B32B 2307/706 (2013.01); B32B 2307/708 (2013.01); B32B 2307/72 (2013.01); B32B 2307/722 (2013.01); B32B 2307/732 (2013.01); B32B 2457/10 (2013.01); B32B 2457/20 (2013.01); F28F 2270/00 (2013.01); F28F 2275/025 (2013.01);
Abstract

A heat spreading and insulating material using densified foam is provided that has a heat spreading layer that is adhered to an insulating layer. The material is designed to be used with mobile devices that generate heat adjacent to heat sensitive components. The insulating layer is formed from a compressed layer of polyimide foam to increase its density. The polyimide foam retains a significant amount of insulating properties through the densification process. In some embodiments, an EMI shielding layer is added to improve electrical properties of the device. The heat spreading layer may be a graphite material with heat conducting properties that preferentially conduct heat in-plane but can also be metal foil or other isotropic heat conducting material. The material may also include pressure sensitive layers to permanently apply the material to the mobile device.


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